High Strength Tungsten Alloy W90NiFe4 Tungsten Steel Plate Customized

Vapor chambers provide significantly enhanced thermal performance compared to traditional solid metal heat spreaders used in conventional CPU cooling systems. These planar heat pipes feature a flat metal enclosure with an integrated wick structure lining.

As two-phase thermal management devices with large, flat surfaces, vapor chambers efficiently distribute heat from high-power or high-heat-flux electronic components. When replacing standard base plates or heat pipes in thermal assemblies, they can reduce conduction losses (Delta-T) by 50% or more, resulting in substantially lower overall thermal resistance.

The adoption of vapor chamber technology has accelerated in recent years, driven by increasing power density from shrinking semiconductor die sizes. Modern vapor chambers offer improved capabilities and reduced costs compared to earlier generations, enhancing their value proposition and application flexibility across various industries.

Traditional vapor chamber manufacturing involves two stamped metal plates with mirrored geometries, enabling designs ranging from simple squares to complex configurations. While typically not exceeding 400mm for electronics cooling applications, vapor chambers can reach widths up to 150mm, providing extensive surface area for heat dissipation. Embossments or reliefs stamped into the plate design accommodate variations in component height along printed circuit boards.