0.09mm Ultra High Precision Laser Soldering Tungsten Carbide Nozzle with 400,000 Times Service Life for Semiconductor Industry

0.09mm Ultra High Precision Laser Soldering Tungsten Carbide Nozzle with 400,000 Times Service Life for Semiconductor Industry

Product Details:
Place of Origin:	China
Brand Name:	Sanxin
Certification:	ISO
Model Number:	SX0004-3
Payment & Shipping Terms:
Minimum Order Quantity:	1 piece
Price:	Negotiable
Packaging Details:	Safety Packing
Delivery Time:	15~45 Days
Payment Terms:	L/C,T/T,Western Union
Supply Ability:	10-50000pcs/month

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Detail Information
Product Description

Detail Information
Name:	Tungsten Carbide Nozzle	Carbide Grade:	Co 10%, And Other Grades Like K10, K20, K30 Etc
Surface Polish:	Shiny Mirror Polishing	Type:	Carbide Nozzle Tin Ball Spray
Application:	Semiconductor Industry	Usage:	Electronics
Highlight:	tungsten carbide sandblast nozzles , hardened steel nozzle

Product Description

0.09mm Ultra High Precision Laser Soldering Carbide Tin Ball Nozzle

This 15mm tin ball tungsten steel nozzle from Zhuzhou Sanxin is engineered for precision laser welding applications. Designed specifically for laser tin ball welding and tin ball laser injection equipment operations, it ensures stable welding quality and high yield rates across different joint configurations.

Precision Engineering

Features an ultra-precise φ0.09mm laser beam inlet hole where the carbide nozzle heats tin balls for soldering purposes. After six years of development by our technical team, each carbide nozzle delivers a service life exceeding 400,000 cycles, meeting high-volume production demands while improving efficiency and reducing maintenance costs.

Product Specifications

Standard Size: D2.2*0.8*0.09*5.7L*d1.5
Custom Sizes: Available based on customer drawings

Material Composition

Constructed from tungsten carbide (WC - wolfram carbide), a premium cemented carbide material. Standard grade: YL10.2. Customer-specified material grades are also accommodated.

Standard Material Specifications

Property	Specification
Grain size (um)	0.4~2.0
Co%	6.0~20
Density g/cm³	13.96~14.85
Hardness HRA	89.5~93
Flexural strength MPa	3200~4500
Young's Modulus GPa	570~620

Application Details

Designed for advanced laser soldering systems in PCB and component packaging applications, utilizing laser beam as a heat reservoir.

Excellent quality repeatability with fixed soldering volume assurance
Precise non-contact soldering through laser beam size control

Working Parameters

Parameter	Range
Laser Power	20-300W
Wavelength	880-1064nm
Tin ball diameter	0.1-0.5mm
Soldering speed	3-6pcs/s

Packaging

Securely packaged in protective plastic boxes with custom EVA foam inserts for safe transportation and storage.

Tag:

0.09mm Ultra High Precision Laser Soldering Tungsten Carbide Nozzle with 400,000 Times Service Life for Semiconductor Industry

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hardened steel nozzle

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