Mirror Polished Tungsten Carbide Nozzle with 600 °C High-Temperature Resistance and 0.01mm Precision Tolerance for Solder Ball Placement

In modern electronics manufacturing, soldering accuracy directly impacts product reliability and performance. As chip packaging technology advances toward miniaturization and high density, conventional nozzles often suffer from wear and deformation during prolonged high-frequency operation, leading to inconsistent solder ball sizes, misalignment, and other quality defects.

The Tungsten Carbide Solder Ball Nozzle (WC Solder Ball Nozzle) is engineered to address these industry challenges. Crafted from military-grade tungsten carbide with precision machining, our nozzle delivers exceptional wear resistance while ensuring consistent soldering accuracy. Whether for micro-scale BGA ball placement or high-precision semiconductor soldering, this nozzle guarantees stable, reliable performance—helping you improve yield rates and reduce production costs.

Its optimized airflow design ensures smooth solder ball delivery, minimizing spatter, while its superior heat and corrosion resistance make it ideal for demanding soldering environments, including lead-free solder applications. Choosing our Tungsten Carbide Solder Ball Nozzle means choosing higher efficiency, greater stability, and longer-lasting performance.