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Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd

Semiconductor Encapsulation Sleeve Barrels Tungsten Carbide Plunger Pot

Product Details:
Place of Origin: China
Brand Name: Sanxin
Certification: ISO
Model Number: SX1099
Payment & Shipping Terms:
Minimum Order Quantity: 1 piece
Price: Negotiable
Packaging Details: Safety Packing
Delivery Time: 15~45 Days
Payment Terms: L/C,T/T,Western Union
Supply Ability: 10-50000pcs/month
  • Detail Information
  • Product Description

Detail Information

Name: Tungsten Carbide Plunger Pot Application: Semiconductor Encapsulation Sleeve Barrels
Oem Service: Acceptable Advantage: Superior Wear-resistance
Standard: Non-standard/ Standard Are Available Services: OEM & ODM
Highlight:

hardened steel sleeves

,

carbide wear parts

Product Description

Semiconductor Encapsulation Sleeve Barrels Tungsten Carbide Plunger Pot
Also known as: Tungsten steel sleeves, carbide bushings
Semiconductor encapsulation sleeve barrels with tungsten carbide plunger pots are specialized components essential for semiconductor manufacturing processes. These precision components ensure reliability, accuracy, and quality in semiconductor encapsulation, where repeatability is crucial for optimal device performance.
Semiconductor Encapsulation Sleeve Barrels
Function: Designed to house and protect delicate semiconductor components during encapsulation processes, providing a controlled environment for applying materials like epoxies or resins.
Material: Typically manufactured from stainless steel, ceramics, or specialized alloys to withstand chemical and thermal conditions during encapsulation.
Tungsten Carbide Plunger Pot
Function: Precision component used to dispense or apply encapsulating materials with exceptional control and accuracy.
Material: Tungsten carbide is selected for its exceptional hardness, wear resistance, and chemical inertness, making it ideal for withstanding abrasive and corrosive encapsulation materials.
Key Features
Wear Resistance: Tungsten carbide plunger pots offer high wear resistance, ensuring longevity and consistent performance over multiple production cycles.
Precision: Engineered with precision to ensure accurate and repeatable dispensing of encapsulation materials.
Chemical Compatibility: Tungsten carbide is chemically inert and withstands exposure to various encapsulation materials without degradation.
Benefits
Extended Lifespan: Tungsten carbide plunger pots have longer service life compared to conventional materials, reducing replacement frequency and downtime.
Improved Efficiency: Wear resistance and precision contribute to enhanced efficiency and consistent quality in semiconductor encapsulation processes.
Cost-Effectiveness: While having higher upfront costs, their durability and performance deliver long-term cost savings.
Common Materials for Semiconductor Plunger Pots
  • Tungsten Carbide: Known for hardness, wear resistance, and durability; popular choice for withstanding harsh conditions and repetitive use.
  • Ceramics: Materials like alumina or zirconia offer high temperature resistance, electrical insulation properties, and chemical inertness.
  • Stainless Steel: Valued for corrosion resistance, strength, and ease of maintenance in semiconductor applications.
  • Titanium: Provides high strength-to-weight ratio, corrosion resistance, and biocompatibility for specialized semiconductor applications.
  • Plastics: Engineering plastics like PEEK or PTFE offer chemical resistance, electrical insulation, or non-stick properties when required.
Material selection depends on specific application requirements, environmental conditions, desired properties (wear resistance, thermal conductivity, electrical insulation), and budget considerations.
Semiconductor Encapsulation Sleeve Barrels Tungsten Carbide Plunger Pot 0 Semiconductor Encapsulation Sleeve Barrels Tungsten Carbide Plunger Pot 1

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