Product Details:
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Place of Origin: | China |
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Brand Name: | Sanxin |
Certification: | ISO |
Model Number: | SX1099 |
Payment & Shipping Terms:
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Minimum Order Quantity: | 1 piece |
Price: | Negotiable |
Packaging Details: | Safety Packing |
Delivery Time: | 15~45 Days |
Payment Terms: | L/C, T/T, Western Union |
Supply Ability: | 10-50000pcs/month |
Detail Information |
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Name: | Tungsten Carbide Plunger Pot | Application: | Semiconductor Encapsulation Sleeve Barrels |
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Oem Service: | Acceptable | Advantage: | Superior Wear-resistance |
Standard: | Non-standard/ Standard Are Available | Services: | OEM & ODM |
Highlight: | hardened steel sleeves,carbide wear parts |
Product Description
Semiconductor Encapsulation Sleeve Barrels Tungsten Carbide Plunger Pot
Other Name: Tungsten steel sleeves, carbide bushings,
Semiconductor encapsulation sleeve barrels with tungsten carbide plunger pots are specialized components used in semiconductor manufacturing processes. Semiconductor encapsulation sleeve barrels with tungsten carbide plunger pots are essential in ensuring the reliability, precision, and quality of semiconductor encapsulation processes, where accuracy and repeatability are crucial for the performance of semiconductor devices.
1,Semiconductor Encapsulation Sleeve Barrels: | 2,Tungsten Carbide Plunger Pot: |
Function: These barrels are designed to house and protect delicate semiconductor components during encapsulation processes, providing a controlled environment for the application of materials such as epoxies or resins. Material: The sleeves are often made from materials like stainless steel, ceramics, or specialized alloys to withstand the chemical and thermal conditions encountered during encapsulation. |
Function: The plunger pot is a component used to dispense or apply encapsulating materials with precision and control. Material: Tungsten carbide is chosen for plunger pots due to its exceptional hardness, wear resistance, and chemical inertness, making it ideal for withstanding the abrasive and corrosive nature of encapsulation materials. |
3,Key Features: | 4,Benefits: |
Wear Resistance: Tungsten carbide plunger pots offer high wear resistance, ensuring longevity and consistent performance over multiple production cycles. Precision: These components are engineered with precision to ensure accurate and repeatable dispensing of encapsulation materials. Chemical Compatibility: Tungsten carbide is chemically inert and can withstand exposure to a wide range of encapsulation materials without degradation. |
Extended Lifespan: Tungsten carbide plunger pots have a longer service life compared to conventional materials, reducing the frequency of replacements and downtime. Improved Efficiency: The wear resistance and precision of these components contribute to improved efficiency and consistent quality in semiconductor encapsulation processes. Cost-Effectiveness: While tungsten carbide components may have a higher upfront cost, their durability and performance contribute to long-term cost savings. |
Materials commonly used for semiconductor plunger pots include:
Tungsten Carbide: Known for its hardness, wear resistance, and durability, tungsten carbide is a popular choice for semiconductor plunger pots due to its ability to withstand harsh conditions and repetitive use.
Ceramics: Certain types of ceramics, such as alumina (aluminum oxide) or zirconia, are used in semiconductor applications for their high temperature resistance, electrical insulation properties, and chemical inertness.
Stainless Steel: Stainless steel is often used for semiconductor plunger pots due to its corrosion resistance, strength, and ease of maintenance.
Titanium: Titanium is known for its high strength-to-weight ratio, corrosion resistance, and biocompatibility, making it suitable for semiconductor applications where these properties are beneficial.
Plastics: Certain engineering plastics like PEEK (Polyetheretherketone) or PTFE (Polytetrafluoroethylene) may be used for semiconductor plunger pots when chemical resistance, electrical insulation, or non-stick properties are required.
The choice of material for semiconductor plunger pots depends on factors such as the specific application requirements, environmental conditions, desired properties (such as wear resistance, thermal conductivity, or electrical insulation), and budget considerations.
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