Customizable Tungsten Carbide Solder Ball Nozzle for Precision Soldering

Product Description

In modern electronics manufacturing, soldering accuracy directly impacts product reliability and performance. As chip packaging technology advances toward miniaturization and high density, conventional nozzles often suffer from wear and deformation during prolonged high-frequency operation, leading to inconsistent solder ball sizes, misalignment, and other quality defects.

The Tungsten Carbide Solder Ball Nozzle (WC Solder Ball Nozzle) is engineered to address these industry challenges. Crafted from military-grade tungsten carbide with precision machining, our nozzle delivers exceptional wear resistance while ensuring consistent soldering accuracy. Whether for micro-scale BGA ball placement or high-precision semiconductor soldering, this nozzle guarantees stable, reliable performance—helping you improve yield rates and reduce production costs.

Its optimized airflow design ensures smooth solder ball delivery, minimizing spatter, while its superior heat and corrosion resistance make it ideal for demanding soldering environments, including lead-free solder applications. Choosing our Tungsten Carbide Solder Ball Nozzle means choosing higher efficiency, greater stability, and longer-lasting performance.

Key Features

1. Extreme Wear Resistance for Longevity

• Made from ultra-hard tungsten carbide (WC), offering 3-5x longer lifespan than stainless steel or ceramic nozzles.
• Ideal for high-frequency soldering operations, reducing downtime and maintenance costs.

2. Precision Ball Placement for Consistent Soldering

• ±0.01mm bore tolerance ensures uniform solder ball size and precise placement, reducing defects.
• Optimized airflow channel minimizes clogging and improves soldering efficiency.

3. High-Temperature & Corrosion Resistance

• Withstands temperatures up to 600°C, compatible with lead-free and other aggressive solders.
• Mirror-polished surface prevents solder sticking for smoother operation.

4. Broad Compatibility & Customization

• Supports solder balls from 0.1mm to 1.0mm (custom sizes available).
• Fits most BGA ball placement, semiconductor, and micro-soldering systems.

Applications

BGA Packaging – Ensures uniform ball grid array soldering
Semiconductor Micro-Soldering – Precision placement for tiny solder pads
LED Packaging – Reliable micro-ball dispensing for LED assembly
Consumer & Automotive Electronics – Ideal for smartphone PCBs, sensors, and more