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Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd
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Home ProductsTungsten Carbide NozzleMicron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding
Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding
Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding

Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding

Product Details:
Place of Origin: Zhuzhou
Brand Name: Sanxin
Certification: ISO 9001
Model Number: SX1255
Payment & Shipping Terms:
Minimum Order Quantity: 2
Delivery Time: 5-25days
Payment Terms: L/C,T/T,Western Union
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  • Detail Information
  • Product Description

Detail Information
Purduct Name: Tungsten Carbide Nozzle Usage: Laser Welding Component
Tolerance: ±0.005mm Trs: 1180-2250 N/mm3
Materials: Tungsten Carbide Packing: Standard Export Package
Inner Hole: Customized Dimenstion: Customized
Density: 14.9 G/cm3 Keywords: Cemented Carbide Nozzle
Highlight:

Tungsten Carbide Solder Ball Blasting Nozzle

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Micron-level Soldering Blasting Nozzle

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Laser Solder Ball Blasting Nozzle

Product Description

Micron-level Soldering Laser Solder Ball Tungsten Carbide Blasting Nozzle with ±0.005mm Tolerance
Micron-level soldering expert: Carbide laser solder ball nozzle
Introduction

200-1500μm full range coverage with zero hole blocking and coaxiality ±0.002mm. This nozzle overcomes traditional limitations of hole blocking and solder sticking, enabling millions of precise, burr-free and splash-free solder ball injections for microelectronics packaging applications.

Specification
Solder ball size (μm) Inner diameter (mm) Tolerance standard Applicable scenarios
200-250 Φ0.09-0.12 ±0.001mm IC wafer/acoustic device micro solder joint
300-350 Φ0.34±0.003 ±0.003mm Mobile phone camera/data cable solder joint
450-600 Φ0.55-0.65 ±0.004mm Automotive radar/FPC soft board
750-900 Φ0.85-0.95 ±0.005mm Power module/relay (main model)
1000-1500 Φ1.02-1.50 ±0.008mm High power PCB ground pad
PS. : The size is for reference only, customization is supported
Application
Consumer electronics
  • Mobile phone camera module: 0.15mm solder joint spacing CCM welding (350μm solder ball nozzle)
  • Type-C interface terminal: multi-level countersunk hole precision welding (aperture tolerance ±0.003mm)
  • TFT/FPC flexible screen: non-contact welding in temperature sensitive areas (avoid electrostatic damage)
High-end electronics and semiconductors
  • Reversing radar sensor: anti-vibration welding (600μm nozzle for 1.0mm pad)
  • IC wafer packaging: φ0.09μm micro-hole solder ball precise positioning (coaxiality ≤0.005)
  • Optical module fiber coupling: spatter-free welding (inert gas protection process)
Industrial core components
  • Automobile key chip: micro solder joint oxidation resistance (400μm nozzle)
  • Fuse ceramic tube: stable spraying in high temperature environment (temperature resistance >850℃)
Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding 0 Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding 1

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tungsten carbide blasting nozzle

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