Micron-level Soldering Laser Solder Ball Tungsten Carbide Blasting Nozzle

Product Description

Micron-level soldering expert: Carbide laser solder ball nozzle

Introduction:
200-1500μm full range coverage —zero hole blocking·coaxiality ±0.002

It breaks through the bottlenecks of hole blocking and solder sticking of traditional nozzles, and realizes tens of millions of burr-free and splash-free precise solder ball injection in the field of microelectronics packaging.

Specification:

PS. : The size is for reference only, customization is supported

Application:

Consumer electronics
Mobile phone camera module: 0.15mm solder joint spacing CCM welding (350μm solder ball nozzle)
Type-C interface terminal: multi-level countersunk hole precision welding (aperture tolerance ±0.003mm)
TFT/FPC flexible screen: non-contact welding in temperature sensitive areas (avoid electrostatic damage)

High-end electronics and semiconductors
Reversing radar sensor: anti-vibration welding (600μm nozzle for 1.0mm pad)
IC wafer packaging: φ0.09μm micro-hole solder ball precise positioning (coaxiality ≤0.005)
Optical module fiber coupling: spatter-free welding (inert gas protection process)

Industrial core components
Automobile key chip: micro solder joint oxidation resistance (400μm nozzle)
Fuse ceramic tube: stable spraying in high temperature environment (temperature resistance >850℃)